Added multi-chip functionality.

[6biscuits]

Functions for multi-die chips

• calc_die_centres for calculating origins of die on a multi-die chip - can also automatically place die to fill up the chip.
• place_launchpads for automatic launchpad placement and labelling
• place_resonators_hanger for easy placement of CPW resonators (includes calculation of CPW parameters and frequencies)

Extra export functionality

• added arguments to MakeGDS to allow for layer-merging upon export (i.e. for negative or positive patterns)
• added arguments to MakeGDS to allow for manually-chosen layer exports

Full chip maker

• created Utilities.FullChipMaker for automatic multi-die chip creation with all required inputs available. This is still a work in progress, and so far only supports basic hanger-mode resonator chips. Perhaps we can continue to add to this over time, or can also accept a design/snippet of an existing design as an input

[PP501]

Looks good - we should keep an eye on MakeGDS to ensure that it still exports correctly for typical use cases. Maybe we can make a unit-testing regime for it later.

[6biscuits]

Looks good - we should keep an eye on MakeGDS to ensure that it still exports correctly for typical use cases. Maybe we can make a unit-testing regime for it later.

Agreed. The default behaviour should still export all layers separately, as well as all negative layers. I'll test this properly soon.