What steps will reproduce the problem?
1.add a white solder pad and a white copper trace to layer 2 above a black
ground plane on layer 3
2.change their respective sizes from 0.09" to 0.12" and 1mm to 2mm
3.add a black, normally sized solder pad and trace to layer 1 directly over the
white solder pad and trace (in order to separate solder pads and traces from
ground plane)
What is the expected output? What do you see instead?
I expect to see the normally sized, black traces and pads centered within the
over-sized white pads and traces. Black pads and traces on layer 1, white pads
and traces on layer 2, black ground plane on layer 3. Instead, the white pads
'break up' the connection between the black traces and pads as if it were a
level above the black trace.
Whenever possible, please attach the latest log file. It will
provide valuable information when trying to reproduce and locate the
problem. Log files can be found in the log directory under the main
application directory and are marked with date and time.
What version of the product are you using? On what operating system?
3.28.0 on Windows XP Pro
Please provide any additional information below.
Thanks for all your hard work, it's a great program!
Original issue reported on code.google.com by chordoph...@gmail.com on 9 Sep 2013 at 7:18
Original issue reported on code.google.com by
chordoph...@gmail.comon 9 Sep 2013 at 7:18Attachments: