Print the layer segment that is right above a support interface layer as cold as it can be printed without underextruding.
Process:
1) Identify the supported segments.
2) Right before the start of a supported segment, set the temperature to a temperature of choice that is lower than the normal printing temperature (f.e. 20° lower), at the same time move the printhead to a wipe tower where it will be wiping for n seconds, where n is to be set manually (f.e. 5 or 10 seconds); this will give the hotend time to cool down. Then return to the print.
3) Right after the end of a supported segment, set the temperature to normal temperature, at the same time move the printhead to a wipe tower where it will wiping for m seconds; this will give the hotend time to heat up. Then return to the print.
The purpose is to further reduce bonding strength between print and supports.
Print the layer segment that is right above a support interface layer as cold as it can be printed without underextruding. Process: 1) Identify the supported segments. 2) Right before the start of a supported segment, set the temperature to a temperature of choice that is lower than the normal printing temperature (f.e. 20° lower), at the same time move the printhead to a wipe tower where it will be wiping for n seconds, where n is to be set manually (f.e. 5 or 10 seconds); this will give the hotend time to cool down. Then return to the print. 3) Right after the end of a supported segment, set the temperature to normal temperature, at the same time move the printhead to a wipe tower where it will wiping for m seconds; this will give the hotend time to heat up. Then return to the print.
The purpose is to further reduce bonding strength between print and supports.