Gw30 hardware work

[esden]

This patchset contains a bunch of mostly cosmetic improvements to the board layout and footprints.

• Updated generic part footprints to the new V5 KiCad library versions
  • This change also updates the links to the 3d models so that rendering the board in KiCad now displays all the resistors, capacitors and inductors correctly.
• Added the QFN48 3d model to the CC430F613x footprint.
• Added courtyards to all the custom footprints. JEDEC recommends a 0.25mm perimeter around evry SMD part to accomodate Pick&Place machine placement accuracy.
• Changed all small pads to be roundrect instead of square. Roundrect has better solder stencil release and reflow characteristics.
• Replaced all Y trace junctions with T junctions. This decreases the probability of acid traps in PCB manufacturing.
• Replaced RFVCC trace network with a fill rectangle.
• Added smaller trace-space GND fill for the small parts on the back side of the board.
• Moved schematic sheet legend from free floating text to the schematic sheet dialog/table. Also copied the same data to the PCB layout sheet.

I am not sure this list is complete, but I tried my best. The most important changes are those related to DFM and Pick&Place solder stencil. But I also gave in to a bunch of OCD cleanups too. :)

[travisgoodspeed]

Thank you kindly!

I expect to place an order for for boards on Monday. Please comment in #100 if you see anything else that should be changed in this revision. Other changes can wait for the GW31.