Guilouz/Marlin-SuperRacer-MKS-Nano-V3

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Marlin 2.0.8 Firmware configured for FLSUN Super Racer with MKS Robin Nano V3 motherboard. Based on FLSUN sources.

Downloads:

Firmwares for Super Racer Stock are available in here.
Firmwares for Super Racer + Bondtech LGX Lite are available at the bottom of the page.

Main features:

MKS Robin Nano V3 motherboard support
TMC2209 / TMC2226 UART drivers support
Nozzle & Bed PID support
Enabled thermal protection for Nozzle & Bed
Bed Leveling Bilinear 9 x 9 point support
Nozzle Park / Advanced Pause support with improved position
Babystepping with Combine Z-Offset support
EEPROM support
S-Curve Acceleration support
Bed Skew Compensation support (https://www.thingiverse.com/thing:2563185)
Delta Diagonal Rod Trim adjustments support
G26 - Mesh Validation Pattern support
G33 - Delta Auto Calibration support
Enabled StealthChop for extruder
Disabled Power Loss Recovery because not correctly implemented, repeated writes to the EEPROM are performed. Not good for EEPROM.
Binary file transfert support to transfer and update the firmware remotely
Enabled host prompt support
Enabled Firmware Info with M115
Enabled monitor for TMC drivers
Enabled M106 to report the new fan speed when changed
Improved probing speed
Improved buffer size
Fix TMC drivers settings
Disabled not used settings

Installation procedure:

Do an EEPROM reset before flashing the new firmware (command M502 followed by command M500 in a terminal or with the TFT screen).
Restart the printer.
Choose version you want here, SDCARD to use microSD Card port or USB to use USB port.
Copy Robin_nano_v3.bin file to the root of the microSD card (max capacity 32GB, formatted in FAT32, allocation unit size 4096).
With printer off, insert the microSD card into the dedicated port on the motherboard and turn on the printer.
Flash procedure starts (without displaying anything on the screen) and lasts a few seconds.
Check contents of the microSD card, Robin_nano_v3.bin file has been renamed to ROBIN_NANO_V3.CUR which indicates that the flash was successful.
It's possible after flash you loose text on TFT screen, select your language again and save.
Do an EEPROM reset again (command M502 followed by command M500 in a terminal or with the TFT screen).
Restart the printer.
To disable redundant "Not SD printing" commands:
- M27 S0
Launch a Nozzle PID in a terminal:
- M303 E0 S220 C8
- Retrieve the values Kp, Ki and Kd then:
- M301 PKp IKi DKd
- Then M500 to save.
Launch a Bed PID in a terminal:
- M303 E-1 S90 C8
- Retrieve the values Kp, Ki and Kd then:
- M304 PKp IKi DKd
- Then M500 to save.
Launch an extruder calibration in a terminal:
- Heat your hotend to its usual operating temperature :
- M109 Sxxx where xxx is temperature
- Make a pencil mark at 120mm on the filament from the hole on the top of the printer (where we insert the filament)
- M83 to switch to relative mode.
- G1 E100 F100 for extruding 100mm.
- Wait until the end of the extrusion and measure if there is still 20mm of the line on the filament until the filament inlet otherwise apply this calculation:
  - To obtain extrusion length: 120 - (value measured between the line and the filament inlet)
  - To obtain number of steps to have extruded 100mm: (value of E-steps/mm) x 100. Default E-Steps value is 415.
  - To obtain the new E-steps/mm: (number of steps to have extruded 100mm) / (extrusion length)
- M92 E(new E-steps/mm)
- Then M500 to save.
Launch a Delta Calibration a wait until end of process :
- Make sure to connect bed level probe before to start the following command.
- G33
- Then M500 to save.
Start auto-leveling from the TFT screen menu and adjust Z-Offset. Don't forget to save.
Perform a full format of your SD card (not a quick format) to avoid problems afterwards.
If you want more precision or solve dimension problems, follow the instructions in this Excel file: Delta Calibration Calculator.zip

Link for a terminal: Printrun (ex Pronterface)

Screen firmware:

This Marlin firmware also requires updating the screen firmware, follow these instructions :

Format microSD to FAT32 with allocation unit size to 4096.
Extract screen firmware zip file here : Screen Firmware V1.3 Stock from FLSUN and copy DWIN_SET folder to the root of the microSD card.
Turn off printer.
Remove the screen cover and insert the card into the microSD slot.
Turn on the printer.
Screen firmware installation begins immediately, you will see several scrolling lines.
When the END ! appears on the screen, turn off printer and remove the microSD card.
Installation is complete, you can replace the screen cover and turn the printer back on.

Capture d’écran 2021-10-01 à 18 59 01

Possible changes:

If you need to make any changes in sources files, please read this for compilation: here

Use VSCode et PlatformIO for compilation (see here).

If you want to use microSD port, set these values:
- In Configuration_adv.h: //#define USB_FLASH_DRIVE_SUPPORT
- In Configuration_adv.h: //#define USE_OTG_USB_HOST
If you want to use USB port, set these values :
- In Configuration_adv.h: #define USB_FLASH_DRIVE_SUPPORT
- In Configuration_adv.h: #define USE_OTG_USB_HOST
If Trianglelab CHC Pro (104NT-4-R025H42G) HEATBLOCK, set these values:
- In Configuration.h: #define TEMP_SENSOR_0 5
- In Configuration.h: #define DEFAULT_Kp 13.0091
- In Configuration.h: #define DEFAULT_Ki 1.9370
- In Configuration.h: #define DEFAULT_Kd 21.8422
If you have SKR 1.3 motherboard, set these values:
- In platformio.ini: default_envs = LPC1768
- In Configuration.h: #define MOTHERBOARD BOARD_BTT_SKR_V1_3
- In Configuration.h: #define SERIAL_PORT -1
- In Configuration.h: #define SERIAL_PORT_2 0
- In Configuration_adv.h: #define E0_AUTO_FAN_PIN P2_04
If you have OMG-V2-S EXTRUDEUR (BOWDEN), set these values:
- In Configuration.h: #define DEFAULT_AXIS_STEPS_PER_UNIT { 80, 80, 80, 385 }
- In Configuration.h: #define INVERT_E0_DIR true
- In Configuration_adv.h: #define E0_CURRENT 1050
If you have BONDTECH LGX EXTRUDEUR (BOWDEN), set these values :
- In Configuration.h: #define DEFAULT_AXIS_STEPS_PER_UNIT { 80, 80, 80, 400 }
- In Configuration.h: #define INVERT_E0_DIR false
- In Configuration_adv.h: #define E0_CURRENT 650
If you have BONDTECH LGX LITE EXTRUDEUR (DIRECT DRIVE), set these values:
- In Configuration.h: #define DEFAULT_AXIS_STEPS_PER_UNIT { 80, 80, 80, 562 }
- In Configuration.h: #define INVERT_E0_DIR false
- In Configuration.h: #define DEFAULT_MAX_FEEDRATE { 200, 200, 200, 120 }
- In Configuration.h: #define DEFAULT_MAX_ACCELERATION { 6000, 6000, 6000, 1500 }
- In Configuration.h: #define DEFAULT_ACCELERATION 2500
- In Configuration.h: #define DEFAULT_RETRACT_ACCELERATION 2000
- In Configuration.h: #define DEFAULT_XJERK 10.0
- In Configuration.h: #define DEFAULT_YJERK 10.0
- In Configuration.h: #define DEFAULT_ZJERK 10.0
- In Configuration.h: #define DEFAULT_EJERK 2.5
- In Configuration_adv.h: #define E0_CURRENT 650
- In Configuration_adv.h: #define FILAMENT_CHANGE_UNLOAD_LENGTH 70
- In Configuration_adv.h: #define FILAMENT_CHANGE_FAST_LOAD_LENGTH 70
- In Configuration_adv.h: //#define STEALTHCHOP_E
If you have Trianglelab CHC Pro (104NT-4-R025H42G) HEATBLOCK, set these values:
- In Configuration.h: #define TEMP_SENSOR_0 5
- In Configuration.h: #define DEFAULT_Kp 13.0091
- In Configuration.h: #define DEFAULT_Ki 1.9370
- In Configuration.h: #define DEFAULT_Kd 21.8422

Firmware for Bondtech LGX Lite:

Files and materials needed:

	LGX Lite Support	- Requires 2 x M3x12 screws to secure the LGX Lite to the bracket - Using stock screws to secure everything - Requires 2 x 5015 fans (optional) - Requires 2 x M3x16 screws for 5015 fans (optional) - Requires 2 x M3x20 screws for 5015 fans (optional)
	Filament Sensor Mount.zip	- Using stock screws
	Cable Guide.zip	- N/A