SiEPIC / openEBL-2024-05

Submission for fabrication of silicon photonics for the openEBL run
https://siepic.ca/openebl/
MIT License
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openEBL Design Submissions

Fabrication process: Passive Silicon

Technical summary:

Layer table

Name Layer/datatype Description
Si 1/99 Layer to draw silicon geometries
Floorplan 99/0 Marks the layout design area
Text 10/0 Text labels for automated measurements
DevRec 68/0 Device recognition layer for component connectivity, netlist extraction, and verification
PinRec 1/10 Port/pins recognition layer for component connectivity, netlist extraction, and verification
Waveguide 1/99 Virtual layer, guiding shape for waveguide, used for length calculation
SEM 200/0 Requests for SEM images. Rectangles in a 4:3 aspect

Submission instructions:

The submission involves several steps. First, you need to create your design(s) using the process design kit (PDK) for this specific fabrication run. Then you need to create a Fork of this repository, commit your design(s), ensure that it passes the checks, and create a pull request. Once your pull request is approved, your design(s) will be merged into the layout for fabrication. You should verify that your design is correctly merged. Once the designs are fabricated, they will be tested, and the measurement results will be posted in this repository.

Design software and PDK installation instructions:

Submission via GitHub

image

Black-box cells (IP Replacement)

Automated GitHub Actions

Optional: The verification and merging is performed using GitHub actions. The repository implements the following: 1) Running the Python files in the "submissions/KLayout Python" folder, to generate the designs 2) Performing Manufacturing DRC verification on the designs in the "submissions" folder, and outputing the errors as an Artifact 3) Performing Functional verification on the designs in the "submissions" folder, and outputing the errors as an Artifact 4) Merging the designs from the "submissions" folder, and outputing merged layout as an Artifact in the main repository

Merged Layout File

Layout file: EBeam_2024_05_18.oas

image

Measurement Results

The chip fabrication was completed on June 7, 2024. The chip was mounted and aligned on an automated PIC measurement station. The passive measurement result of the chip can be found here.

SEM images of the fabricated designs

Scanning electron microscope images of some of the devices from this fabrication run were taken, and are available in the "SEM images" folder, and shown here:

SEM image – optical fibre grating coupler SEM image – y-branch splitter SEM image – directional coupler SEM image – adiabatic 1x2 splitter SEM image – subwavelength grating waveguides SEM image – Bragg grating SEM image – lithgraphy test structure SEM image – lithgraphy test structure