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bespoke-silicon-group / bsg_packaging

BaseJump Open-Source Hardware Accelerator Packages and Sockets
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The python program bond_diagram_generator coundn't run properly #8

Open zhongpanwu opened 2 years ago

zhongpanwu commented 2 years ago

Hello, I am trying to run the bond_diagram_generator to have a padring diagram pdf file. However, both the scirpts draw_wire_binds.py and draw_die.py have a same problem that the line 19 in function csv_to_map complains about the out range of index, any help from you can help me solve this problem? Also, are there any documents from you about the tools and scripts which can share to me? Thanks in advance.

taylor-bsg commented 2 years ago

@stdavids

zhongpanwu commented 2 years ago

Hello, I think I solved the problem, but I just have one more question. In the final bonding pad diagram (/to_assembly_house/example_files_for_assembly_house/final_combined.png), the first wire on the most left-bot side is off. So my questions are: 1, which pinout connects to it? 2, did you do it on purpose or corrected it manually before the submission to assembly house? I am expecting to get any replication from you. Thanks.

zhongpanwu commented 2 years ago
Screen Shot 2021-08-09 at 10 30 32 AM
taylor-bsg commented 2 years ago

Hi, if you figured out a fixed, appreciate a pull request!

Regarding your question, I believe you are asking why the wire can be misaligned with the red mark. If you look at the picture of the package, the entire blue ring is exposed (no soldermask), so the bondhouse can actually bond anywhere on that ring as long as they don't short the wires together. Generally speaking, the bondhouse takes the position of wires on the ring as a guidance rather than a requirement. This may be useful for them to get around hard cases.