In this directory are a bunch of subdirectories, one for each unique BGA (ball grid array) package.
Currently there are three packages:
ucsd_bga: 4 full duplex 9 bits channels, verified from 3x3 to 5x5 die size; probably does 6x6mm.
uw_bga: 2 full duplex 9 bit channels, plus 32-bit LPDDR interface, targets 3x3mm; likely can go to 3.7x3.7 mm.
gf (obsolete)
If you use these packages in your publications, please acknowledge the use as "We employed the Open Source BaseJump name of package from the Bespoke Silicon Group (https://bsg.ai)."
There is also the common directory, which contains files for constructing padrings, including portability files for each process (e.g. tsmc 250) being targeted.