In this directory are a bunch of subdirectories, one for each unique BGA (ball grid array) package.

Currently there are three packages:

• ucsd_bga: 4 full duplex 9 bits channels, verified from 3x3 to 5x5 die size; probably does 6x6mm.

• uw_bga: 2 full duplex 9 bit channels, plus 32-bit LPDDR interface, targets 3x3mm; likely can go to 3.7x3.7 mm.

• gf (obsolete)

If you use these packages in your publications, please acknowledge the use as "We employed the Open Source BaseJump name of package from the Bespoke Silicon Group (https://bsg.ai)."

There is also the common directory, which contains files for constructing padrings, including portability files for each process (e.g. tsmc 250) being targeted.