(this is for the BTT EDDY USB version): got a request in to BTT on amazon for replacement so... fingers crossed there. But I thought i would try to let someone - anyone - know a possible reason why this thing is so inconsistent in its success rate, configuration issues, and so on:
I've been having the countless issues with my BTT Eddy others have been having as well. the cant read probe, eddy probe error, probe already triggered, all that stuff - I made macros to go through the steps over and over again:BTT_EDDY_STEP1, BTT_EDDY_STEP2BTT_EDDY_STEP3 ... I got this product in July, Its now October. I've been trying to make it work for FOUR months.
My reg_drive_current after a lot of testing became 16 and even consistently 17 (as in, the calibrate was actually recommending it) -- But not Everyon has a 10x AmScope to actually look at these things...
(Disclaimer, I'm a hobbyist. I didn't know what a ceramic capacitor was until 3 days ago):
Taking it apart I noticed some interesting stuff. First, there is a "conflict of angles" between the probe PCB and inner slot/guides inside the case as in one angle has +1 degree down and the other is +1 degree up (even if the guides are at perfect 90 degrees inside the shell).
(I didnt mark this in the image BUT inside the blue circle you can see a piece of plastic that acts as a "guide" to force the sensor PCB down.)
When putting the case back together, there was a gap between the pcb and the shell; when under pressure the shell forces the gab to close, putting even more pressure on that connection with the solder connection to the sensor:
So what do these two things mean? The BTT Eddy is putting some stress in a place that there SHOULD NOT BE. Solder may be metal and have some flex, but what it connects to MIGHT NOT. Which brings me to the next points.
under a 10x microscope, I actually found a minor gap between the pad and and the PCB it was supposed to be part of. It is difficult to see but putting pressure on that part showed some flex; the nub on the top left of the solder is actually the extension of the pad that is supposed to make contact with the Ceramic Capacitor AFAIK. It may look close to contact with the PCB , but i promise you it was MUCH FARTHER from the board when i pushed down on it to see if my eyes were deceiving me:
On the left (bottom in image) of the capacitor, and both sides of thermistor, Solder aws applied not only to the pads on the PCB but directly contacting the SMD. on the RIGHT (top in image) solder was NOT directly contacting the SMD.
I Did some micro-soldering and extended the solder on the right side of the ceramic capacitor (bypassing the loose pad). I also may have kinda-sorta... maybe... lost the thermistor on the right entirely - BUT using the MCU sensor as my temperature probe....
It now works BETTER than when i purchased it. (still want a new one though, miss that probe thermistor). It is actually reliable like i have heard so many people say before.
Futher investigation showed what this youtuber had done, https://youtu.be/0sucEbgGC_0?si=M3mSOVA57AwH3pl5&t=716, and i knew i was on the right track. he Redid the whole thing - and i think he did prior to even using it once - and said it worked perfect.
So thats it! you have a flaw in your production/manufacturing. Those weak pads on the sensor board most likely CANNOT take the stress of whatever is happening during completion (putting together) of the probes. So you end up with some that work perfectly out the gate, and some that have no exact fix . If the sensor gets stress in one direction, maybe it tugs on the solder in the back; if it gets pulled downwards - even the slightest bit - it may lose those pads on the board.
tldr; if you have a lot of a product that work in completely different ways, chances are its not the people using it. :(
The concept of the Eddy probe is amazing. Yours is very compact and not a huge horizontal thing. Its a good design. But these flaws are killing your products consistency.
Somehow i want to keep using this thing - even through it
destroyed two Z-endstops (due to very sketchy probe_calibate auto script)
(luke@bigtree-tech.com pls read:)
(this is for the BTT EDDY USB version): got a request in to BTT on amazon for replacement so... fingers crossed there. But I thought i would try to let someone - anyone - know a possible reason why this thing is so inconsistent in its success rate, configuration issues, and so on:
I've been having the countless issues with my BTT Eddy others have been having as well. the cant read probe, eddy probe error, probe already triggered, all that stuff - I made macros to go through the steps over and over again:
BTT_EDDY_STEP1,BTT_EDDY_STEP2BTT_EDDY_STEP3... I got this product in July, Its now October. I've been trying to make it work for FOUR months.My reg_drive_current after a lot of testing became 16 and even consistently 17 (as in, the calibrate was actually recommending it) -- But not Everyon has a 10x AmScope to actually look at these things...
(Disclaimer, I'm a hobbyist. I didn't know what a ceramic capacitor was until 3 days ago):
Taking it apart I noticed some interesting stuff. First, there is a "conflict of angles" between the probe PCB and inner slot/guides inside the case as in one angle has +1 degree down and the other is +1 degree up (even if the guides are at perfect 90 degrees inside the shell).
(I didnt mark this in the image BUT inside the blue circle you can see a piece of plastic that acts as a "guide" to force the sensor PCB down.)
When putting the case back together, there was a gap between the pcb and the shell; when under pressure the shell forces the gab to close, putting even more pressure on that connection with the solder connection to the sensor:
So what do these two things mean? The BTT Eddy is putting some stress in a place that there SHOULD NOT BE. Solder may be metal and have some flex, but what it connects to MIGHT NOT. Which brings me to the next points.
under a 10x microscope, I actually found a minor gap between the pad and and the PCB it was supposed to be part of. It is difficult to see but putting pressure on that part showed some flex; the nub on the top left of the solder is actually the extension of the pad that is supposed to make contact with the Ceramic Capacitor AFAIK. It may look close to contact with the PCB , but i promise you it was MUCH FARTHER from the board when i pushed down on it to see if my eyes were deceiving me:
On the left (bottom in image) of the capacitor, and both sides of thermistor, Solder aws applied not only to the pads on the PCB but directly contacting the SMD. on the RIGHT (top in image) solder was NOT directly contacting the SMD.
I Did some micro-soldering and extended the solder on the right side of the ceramic capacitor (bypassing the loose pad). I also may have kinda-sorta... maybe... lost the thermistor on the right entirely - BUT using the MCU sensor as my temperature probe....
It now works BETTER than when i purchased it. (still want a new one though, miss that probe thermistor). It is actually reliable like i have heard so many people say before.
Futher investigation showed what this youtuber had done, https://youtu.be/0sucEbgGC_0?si=M3mSOVA57AwH3pl5&t=716, and i knew i was on the right track. he Redid the whole thing - and i think he did prior to even using it once - and said it worked perfect.
So thats it! you have a flaw in your production/manufacturing. Those weak pads on the sensor board most likely CANNOT take the stress of whatever is happening during completion (putting together) of the probes. So you end up with some that work perfectly out the gate, and some that have no exact fix . If the sensor gets stress in one direction, maybe it tugs on the solder in the back; if it gets pulled downwards - even the slightest bit - it may lose those pads on the board.
tldr; if you have a lot of a product that work in completely different ways, chances are its not the people using it. :(
The concept of the Eddy probe is amazing. Yours is very compact and not a huge horizontal thing. Its a good design. But these flaws are killing your products consistency.
Somehow i want to keep using this thing - even through it