Alfio Gliozzo - IBM T.J.Watson, New York - gliozzo@us.ibm.com
Octavian Popescu - IBM T.J.Watson, New York - o.popescu@us.ibm.com
Daniele Pighin - Google Inc. - daniele.pighin@gmail.com
Yashar Mehdad - Yahoo research, San Francisco - ymahdad@gmail.com
Elena Cabrio - University of Nice Sophia Antipolis - elena.cabrio@unice.fr
Cu Duy Nguyen - University of Luxembourg (moved to a company on August)
Sergio Mover - University of Colorado, Boulder
Leo Braga - EFFECT Photonics
Heorhi Raik - Facebook
Per Anders Franzen - Cadence (ex jasper design automation)
Di Leo Braga ho anche queste note:
Dr. Leo Huf Campos Braga worked on his PhD at FBK within IRIS team from October 2010 to April 2014. He got his PhD from University of Trento in April 2014 and joined NXP Semiconductors (Eindhoven, The Netherlands) as principal Scientist in August 2014. In January 2016 he moved to EFFECT Photonics where is now Module Engineering Manager of the team in charge of designing the optical communications module, including mechanics, electronics, firmware and optical sub-assembly.
Alfio Gliozzo - IBM T.J.Watson, New York - gliozzo@us.ibm.com Octavian Popescu - IBM T.J.Watson, New York - o.popescu@us.ibm.com Daniele Pighin - Google Inc. - daniele.pighin@gmail.com Yashar Mehdad - Yahoo research, San Francisco - ymahdad@gmail.com Elena Cabrio - University of Nice Sophia Antipolis - elena.cabrio@unice.fr Cu Duy Nguyen - University of Luxembourg (moved to a company on August) Sergio Mover - University of Colorado, Boulder Leo Braga - EFFECT Photonics Heorhi Raik - Facebook Per Anders Franzen - Cadence (ex jasper design automation)
Di Leo Braga ho anche queste note:
Dr. Leo Huf Campos Braga worked on his PhD at FBK within IRIS team from October 2010 to April 2014. He got his PhD from University of Trento in April 2014 and joined NXP Semiconductors (Eindhoven, The Netherlands) as principal Scientist in August 2014. In January 2016 he moved to EFFECT Photonics where is now Module Engineering Manager of the team in charge of designing the optical communications module, including mechanics, electronics, firmware and optical sub-assembly.